Imaging Methods for Novel Materials and Challenging Applications, Volume 3
By:Helena Jin,Cesar Sciammarella,Cosme Furlong,Sanichiro Yoshida
Published on 2012-09-22 by Springer Science & Business Media
Imaging Methods for Novel Materials and Challenging Applications, Volume 3: Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics, the third volume of seven from the Conference, brings together 62 contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental and Applied Mechanics, including papers on: Role of optical interferometry in advancement of material characterization Three-dimensional imaging and volumetric correlation Digital holography and experimental mechanics Digital image correlation Metrology and displacement measurement at different scales Optical methods for dynamic tests Optical methods for and with MEMS and NEMS Thermomechanics and infrared imaging Imaging methods applied to biomaterials and soft materials Applied photoelasticity Optical measurement systems using polarized light Hybrid imaging techniques Contouring of surfaces Novel optical techniques
This Book was ranked at 13 by Google Books for keyword exploring materials and energy level 1 3.
Book ID of Imaging Methods for Novel Materials and Challenging Applications, Volume 3's Books is pZrzn1ToliwC, Book which was written byHelena Jin,Cesar Sciammarella,Cosme Furlong,Sanichiro Yoshidahave ETAG "uHHq03aQiZM"
Book which was published by Springer Science & Business Media since 2012-09-22 have ISBNs, ISBN 13 Code is 9781461442356 and ISBN 10 Code is 1461442354
Reading Mode in Text Status is true and Reading Mode in Image Status is true
Book which have "450 Pages" is Printed at BOOK under CategoryScience
This Book was rated by Raters and have average rate at ""
This eBook Maturity (Adult Book) status is NOT_MATURE
Book was written in en
eBook Version Availability Status at PDF is true and in ePub is true
Book Preview
Tidak ada komentar:
Posting Komentar